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  ? 2005-2016 microchip technology inc. ds20001942g-page 1 mcp9700/9700a mcp9701/9701a features ? tiny analog temperature sensor ? available packages: - sc70-5, sot-23-3, to-92-3 ? wide temperature measurement range: - -40c to +125c (extended temperature) - -40c to +150c (high temperature) (mcp9700, sot-23-3 and sc70-5 only ) ?accuracy: - 2c (max.), 0c to +70c (mcp9700a/9701a) - 4c (max.), 0c to +70c (mcp9700/9701) ? optimized for analog-to-digital converters (adcs): - 10.0 mv/c (typical) (mcp9700/9700a) - 19.5 mv/c (typical) (mcp9701/9701a) ? wide operating voltage range: -v dd = 2.3v to 5.5v (mcp9700/9700a) -v dd = 3.1v to 5.5v (mcp9701/9701a) ? low operating current: 6 a (typical) ? optimized to drive large capacitive loads typical applications ? hard disk drives and other pc peripherals ? entertainment systems ? home appliance ? office equipment ? battery packs and portable equipment ? general purpose temperature monitoring general description mcp9700/9700a and mcp9701/9701a sensors with linear active thermistor integrated circuit (ic) com- prise a family of analog temperature sensors that convert temperature to analog voltage. the low-cost, low-power sensors feature an accuracy of 2c from 0c to +70c (mcp9700a/9701a) and 4c from 0c to +70c (mcp9700/9701) while consuming 6 a (typical) of operating current. unlike resistive sensors, e.g., thermistors, the linear active thermistor ic does not require an additional signal-conditioning circuit. therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing a sensor from these low-cost devices. the voltage output pin (v out ) can be directly connected to the adc input of a microcontroller. the mcp9700/9700a and mcp9701/9701a temperature coefficients are scaled to provide a 1c/bit resolution for an 8-bit adc with a reference voltage of 2.5v and 5v, respectively. the mcp9700/9700a output 0.1c/bit for a 12-bit adc with 4.096v reference. the mcp9700/9700a and mcp9701/9701a provide a low-cost solution for applications that require measure- ment of a relative change of temperature. when mea- suring relative change in temperature from +25c, an accuracy of 1c (typical) can be realized from 0c to +70c. this accuracy can also be achieved by applying system calibration at +25c. in addition, this family of devices is immune to the effects of parasitic capacitance and can drive large capacitive loads. this provides printed circuit board (pcb) layout design flexibility by enabling the device to be remotely located from the microcontroller. adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. however, capacitive load is not required for the stability of sensor output. package types 3-pin sot-23 mcp9700/9700a mcp9701/9701a 3-pin to-92 12 3 gnd v out v dd bottom view mcp9700/9700a mcp9701/9701a 1 gnd v dd v out nc 4 1 2 3 5 5-pin sc70 nc mcp9700/9700a mcp9701/9701a gnd v dd v out 3 12 low-power linear acti ve thermistor ics
mcp9700/9700a and mcp9701/9701a ds20001942g-page 2 ? 2005-2016 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? v dd ....................................................................... 6.0v storage temperature......................... -65c to +150c ambient temp. with power applied... -40c to +150c output current .................................................30 ma junction temperature (t j ).................................. 150c esd protection on all pins (hbm:mm) ..... (4 kv:200v) latch-up current at each pin ....................... 200 ma ? notice: stresses above those listed under ?maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this sp ecification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc electrical characteristics electrical specifications: unless otherwise indicated: mcp9700/9700a: v dd = 2.3v to 5.5v, gnd = ground, t a = -40c to +125c and no load mcp9701/9701a: v dd = 3.1v to 5.5v, gnd = ground, t a = -10c to +125c and no load parameter sym. min. typ. max. unit conditions power supply operating voltage range v dd v dd 2.3 3.1 ? ? 5.5 5.5 v v mcp9700/9700a mcp9701/9701a operating current i dd ?612a i dd ??15a t a = 150c ( note 1 ) line regulation ? c/ ? v dd ?0.1?c/v sensor accuracy ( notes 2 , 3 ) t a = +25c t acy ?1?c t a = 0c to +70c t acy -2.0 1 +2.0 c mcp9700a/9701a t a = -40c to +125c t acy -2.0 1 +4.0 c mcp9700a t a = -10c to +125c t acy -2.0 1 +4.0 c mcp9701a t a = 0c to +70c t acy -4.0 2 +4.0 c mcp9700/9701 t a = -40c to +125c t acy -4.0 2 +6.0 c mcp9700 t a = -10c to +125c t acy -4.0 2 +6.0 c mcp9701 t a = -40c to +150c t acy -4.0 2 +6.0 c hightemperature ( note 1 ) sensor output output voltage, t a = 0c v 0c ? 500 ? mv mcp9700/9700a output voltage, t a = 0c v 0c ? 400 ? mv mcp9701/9701a temperature coefficient t c ?10.0?mv/c mcp9700/9700a t c ?19.5?mv/c mcp9701/9701a output nonlinearity v onl ?0.5? ct a = 0c to +70c ( note 3 ) note 1: mcp9700 with sc70-5 and sot-23-3 packages only. the mcp9700 high temperature is not available with to-92 package. 2: the mcp9700/9700a family accuracy is tested with v dd = 3.3v, while the mcp9701/9701a accuracy is tested with v dd = 5.0v. 3: the mcp9700/9700a and mcp9701/9701a family is characterized using the first-order or linear equation, as shown in equation 4-2 . also refer to figure 2-16 . 4: the mcp9700/9700a and mcp9701/9701a family is characterized and production tested with a capacitive load of 1000 pf. 5: sc70-5 package thermal response with 1x1 inch, dual-sided copper clad, to-92-3 package thermal response without pcb (leaded).
? 2005-2016 microchip technology inc. ds20001942g-page 3 mcp9700/9700a and mcp9701/9701a output current i out ??100a output impedance z out ?20? ? i out = 100 a, f = 500 hz output load regulation ? v out / ? i out ?1? ? t a = 0c to +70c i out = 100 a turn-on time t on ? 800 ? s typical load capacitance c load ? ? 1000 pf note 4 sc-70 thermal response to 63% t res ? 1.3 ? s 30c (air) to +125c (fluid bath) ( note 5 ) to-92 thermal response to 63% t res ?1.65? s dc electrical characteristics (continued) electrical specifications: unless otherwise indicated: mcp9700/9700a: v dd = 2.3v to 5.5v, gnd = ground, t a = -40c to +125c and no load mcp9701/9701a: v dd = 3.1v to 5.5v, gnd = ground, t a = -10c to +125c and no load parameter sym. min. typ. max. unit conditions note 1: mcp9700 with sc70-5 and sot-23-3 packages only. the mcp9700 high temperature is not available with to-92 package. 2: the mcp9700/9700a family accuracy is tested with v dd = 3.3v, while the mcp9701/9701a accuracy is tested with v dd = 5.0v. 3: the mcp9700/9700a and mcp9701/9701a family is characterized using the first-order or linear equation, as shown in equation 4-2 . also refer to figure 2-16 . 4: the mcp9700/9700a and mcp9701/9701a family is characterized and production tested with a capacitive load of 1000 pf. 5: sc70-5 package thermal response with 1x1 inch, dual-sided copper clad, to-92-3 package thermal response without pcb (leaded). temperature characteristics electrical specifications: unless otherwise indicated: mcp9700/9700a: v dd = 2.3v to 5.5v, gnd = ground, t a = -40c to +125c and no load mcp9701/9701a: v dd = 3.1v to 5.5v, gnd = ground, t a = -10c to +125c and no load parameters sym. min. typ. max. units conditions temperature ranges specified temperature range ( note 1 ) t a -40 ? +125 c mcp9700/9700a t a -10 ? +125 c mcp9701/9701a t a -40 ? +150 c high temperature (mcp9700, sot23-3 and sc70-5 only ) operating temperature range t a -40 ? +125 c extended temperature t a -40 ? +150 c high temperature storage temperature range t a -65 ? +150 c thermal package resistances thermal resistance, 5ld sc70 ? ja ?331? c/w thermal resistance, 3ld sot-23 ? ja ?308? c/w thermal resistance, 3ld to-92 ? ja ?146? c/w note 1: operation in this range must not cause t j to exceed maximum junction temperature (+150c).
mcp9700/9700a and mcp9701/9701a ds20001942g-page 4 ? 2005-2016 microchip technology inc. 2.0 typical performance curves note: unless otherwise indicated, mcp9700/9700a : v dd = 2.3v to 5.5v; mcp9701/9701a : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-1: accuracy vs. ambient temperature (mcp9700a/9701a). figure 2-2: accuracy vs. ambient temperature, with v dd . figure 2-3: supply current vs. temperature. figure 2-4: accuracy vs. ambient temperature (mcp9700/9701). figure 2-5: changes in accuracy vs. ambient temperature (due to load). figure 2-6: load regulation vs. ambient temperature. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. -2.0 -1.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50-25 0 255075100125150 accuracy (c) t a (c) mcp9700a v dd = 3.3v mcp9701a v dd = 5.0v spec. limits -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 150 accuracy (c) t a (c) mcp9701/ mcp9701a v dd = 5.5v v dd = 3.1v mcp9700 mcp9700a v dd = 5.5v v dd = 2.3v 0.0 2.0 4.0 6.0 8.0 10.0 12.0 -50 -25 0 25 50 75 100 125 150 t a (c) i dd (a) mcp9700/mcp9700a mcp9701 mcp9701a -4.0 -2.0 0.0 2.0 4.0 6.0 -50-25 0 255075100125150 accuracy (c) t a (c) mcp9700 v dd = 3.3v mcp9701 v dd = 5.0v spec. limits -0.2 -0.1 0 0.1 0.2 -50 -25 0 25 50 75 100 125 150 t a (c) ? accuracy due to load (c) mcp9701/mcp9701a v dd = 5.0v i load = 100 a mcp9700/mcp9700 a v dd = 3.3 v 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 t a (c) load regulation ? v/ ? i ( ? ) mcp9700/mcp9700a mcp9701/mcp9701a v dd = 3.3v i out = 50 a i out = 100 a i out = 200 a
? 2005-2016 microchip technology inc. ds20001942g-page 5 mcp9700/9700a and mcp9701/9701a note: unless otherwise indicated, mcp9700/9700a : v dd = 2.3v to 5.5v; mcp9701/9701a : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-7: output voltage at 0c (mcp9700/9700a). figure 2-8: occurrences vs. temperature coefficient (mcp9700/9700a). figure 2-9: line regulation ( ? c/ ? v dd ) vs. ambient temperature. figure 2-10: output voltage at 0c (mcp9701/9701a). figure 2-11: occurrences vs. temperature coefficient (mcp9701/9701a). figure 2-12: line regulation ( ? c/ ? v dd ) vs. ambient temperature. 0% 5% 10% 15% 20% 25% 30% 35% 400 420 440 460 480 500 520 540 560 580 600 v 0c (mv) occurrences v dd = 3.3v 108 samples mcp9700a mcp9700 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 9.7 9.8 9.8 9.9 10.0 10.1 10.2 10.2 10.3 10.4 10.5 t c (mv/c) occurrences mcp9700 mcp9700a v dd = 3.3v 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 150 normalized line regulation ( ? c/ ? v dd ) t a (c) mcp9700/mcp9700a v dd = 2.3v to 5.5v mcp9700/mcp9700a v dd = 2.3v to 4.0v 0% 5% 10% 15% 20% 25% 30% 35% 300 320 340 360 380 400 420 440 460 480 500 v 0c (mv) occurrences mcp9701 v dd = 5.0v 108 samples mcp9701a mcp9701 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 19.2 19.3 19.3 19.4 19.5 19.6 19.7 19.7 19.8 19.9 20.0 t c (mv/c) occurrences mcp9701 mcp9701a v dd = 5.0v 108 samples 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 normalized line regulation ( ? c/ ? v dd ) t a (c) mcp9701/mcp9701a v dd = 3.1v to 5.5v mcp9701/mcp9701a v dd = 3.1v to 4.0v
mcp9700/9700a and mcp9701/9701a ds20001942g-page 6 ? 2005-2016 microchip technology inc. note: unless otherwise indicated, mcp9700/9700a : v dd = 2.3v to 5.5v; mcp9701/9701a : v dd = 3.1v to 5.5v; gnd = ground, c bypass = 0.1 f. figure 2-13: output voltage vs. power supply. figure 2-14: output vs. settling time to step v dd . figure 2-15: thermal response (air-to-fluid bath). figure 2-16: output voltage vs. ambient temperature. figure 2-17: output vs. settling time to ramp v dd . figure 2-18: output impedance vs. frequency. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 v dd (v) v out (v) t a = +26c 0 2 4 6 8 10 12 -0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 time (ms) v out (v) -2.5 -1.7 -0.8 0.0 0.8 1.7 2.5 i dd (ma) v dd_step = 5v t a = 26c i dd v out 30 55 80 105 130 -2024681012141618 time (s) t a (c) sc70-5 1 in. x 1 in. copper clad pcb leaded, without pcb sc70-5 sot-23-3 to-92-3 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 -25 0 25 50 75 100 125 t a (c) v out (v) mcp9700 mcp9700a mcp9701 mcp9701a 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 time (ms) v out (v) -42.0 -30.0 -18.0 -6.0 6.0 18.0 30.0 i dd (a) i dd v out v dd_ramp = 5v/ms t a = +26c 1 10 100 1000 0.1 1 10 100 1000 10000 100000 frequency (hz) output impedance ( ? ) v dd = 5.0v i out = 100 a t a = +26c 1k 10k 100k 100 10 1 0.
? 2005-2016 microchip technology inc. ds20001942g-page 7 mcp9700/9700a and mcp9701/9701a 3.0 pin descriptions the descriptions of the pins are listed in tab l e 3 - 1 . table 3-1: pin function table 3.1 power ground pin (gnd) gnd is the system ground pin. 3.2 output voltage pin (v out ) the sensor output can be measured at v out . the voltage range over the operating temperature range for the mcp9700/9700a is 100 mv to 1.75v. the voltage range over the operating temperature range for the mcp9701/9701a is 200 mv to 3v. 3.3 power supply input (v dd ) the operating voltage as specified in the dc electrical characteristics table is applied to v dd . 3.4 no connect pin (nc) this pin is not connected to the die. it can be used to improve thermal conduction to the package by connecting it to a printed circuit board (pcb) trace from the thermal source. pin no. sc70 pin no. sot-23 pin no. to-92 symbol function 1 ? ? nc no connect (this pin is not connected to the die.) 2 3 3 gnd power ground pin 322v out output voltage pin 411v dd power supply input 5 ? ? nc no connect (this pin is not connected to the die.)
mcp9700/9700a and mcp9701/9701a ds20001942g-page 8 ? 2005-2016 microchip technology inc. 4.0 applications information the linear active thermistor? ic uses an internal diode to measure temperature. the diode electrical characteristics have a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40c to 150c. the change in voltage is scaled to a temperature coefficient of 10.0 mv/c (typical) for the mcp9700/9700a and 19.5 mv/c (typical) for the mcp9701/9701a. the output voltage at 0c is also scaled to 500 mv (typical) and 400 mv (typical) for the mcp9700/9700a and mcp9701/9701a, respectively. this linear scale is described in the first-order transfer function shown in equation 4-1 and figure 2-16 . equation 4-1: sensor transfer function figure 4-1: typical application circuit. 4.1 improving accuracy the mcp9700/9700a and mcp9701/9701a accuracy can be improved by performing a system calibration at a specific temperature. for example, calibrating the system at +25c ambient improves the measurement accuracy to a 0.5c (typical) from 0c to +70c, as shown in figure 4-2 . therefore, when measuring relative temperature change, this family of devices measures temperature with higher accuracy. figure 4-2: relative accuracy to +25c vs. temperature. the change in accuracy from the calibration tempera- ture is due to the output nonlinearity from the first-order equation, as specified in equation 4-2 . the accuracy can be further improved by compensating for the output nonlinearity. for higher accuracy using a sensor compensation technique, refer to application note an1001, ?ic temperature sensor accuracy compensation with a pic ? microcontroller? (ds00001001). the application note shows that if the device is compensated in addition to room temperature calibration, the sensor accuracy can be improved to 0.5c (typical) accuracy over the operating temperature ( figure 4-3 ). figure 4-3: mcp9700/9700a calibrated sensor accuracy. the compensation technique provides a linear temperature reading. the application note includes compensation firmware so that a look-up table can be generated to compensate for the sensor error. where: t a = ambient temperature v out = sensor output voltage v 0c = sensor output voltage at 0c (see dc electrical characteristics table) t c = temperature coefficient (see dc electrical characteristics table) v out t c t a ? v 0c + = v dd gnd gnd ani v dd gnd v out mcp9700 pic ? mcu -3.0 -2.0 -1.0 0.0 1.0 2.0 3.0 -50 -25 0 25 50 75 100 125 t a (c) accuracy (c) v dd = 3.3v 10 samples -4.0 -2.0 0.0 2.0 4.0 6.0 -50 -25 0 25 50 75 100 125 temperature (c) accuracy (c) + s average - s spec. limits 100 samples
? 2005-2016 microchip technology inc. ds20001942g-page 9 mcp9700/9700a and mcp9701/9701a 4.2 shutdown using microcontroller i/o pin the 6 a (typical) low operating current of the mcp9700/9700a and mcp9701/9701a family makes it ideal for battery-powered applications. however, for applications that require a tighter current budget, this device can be powered using a microcontroller input/output (i/o) pin. the i/o pin can be toggled to shut down the device. in such applications, the micro- controller internal digital switching noise is emitted to the mcp9700/9700a and mcp9701/9701a as power supply noise. however, this switching noise compro- mises measurement accuracy, therefore a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 layout considerations the mcp9700/9700a and mcp9701/9701a family of sensors does not require any additional components to operate. however, it is recommended that a decoupling capacitor of 0.1 f to 1 f be used between the v dd and gnd pins. in high-noise applications, connect the power supply voltage to the v dd pin using a 200 ? resistor with a 1 f decoupling capacitor. a high frequency ceramic capacitor is recommended. it is nec- essary that the capacitor is located as close as possible to the v dd and gnd pins in order to provide effective noise protection. in addition, avoid tracing digital lines in close proximity to the sensor. 4.4 thermal considerations the mcp9700/9700a and mcp9701/9701a family measures temperature by monitoring the voltage of a diode located in the die. a low-impedance thermal path between the die and the pcb is provided by the pins. therefore, the sensor effectively monitors the temperature of the pcb. however, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. this limitation applies to plastic-packaged silicon temperature sensors. if the application requires the measurement of ambient air, the to-92 package should be considered. the mcp9700/9700a and mcp9701/9701a sensors are designed to source/sink 100 a (max.). the power dissipation due to the output current is relatively insignificant. the effect of the output current can be described by equation 4-2 . equation 4-2: effect of self-heating at t a =+25c (v out = 0.75v) and maximum specification of i dd =12a, v dd =5.5v and i out = +100 a, the self-heating due to power dissipation (t j ?t a ) is 0.179c. t j t a ? ? ja v dd i dd v dd v out ? ?? + i out ?? = where: t j = junction temperature t a = ambient temperature ? ja = package thermal resistance (331c/w) v out = sensor output voltage i out = sensor output current i dd = operating current v dd = operating voltage
mcp9700/9700a and mcp9701/9701a ds20001942g-page 10 ? 2005-2016 microchip technology inc. 5.0 packaging information 5.1 package marking information 5-lead sc70 example xxnn device code mcp9700t-e/lt aunn mcp9700at-e/lt axnn mcp9700t-h/lt bcnn mcp9701t-e/lt avnn mcp9701at-e/lt aynn note: applies to 5-lead sc70. bc25 3-lead to-92 3-lead sot-23 example device code mcp9700t-e/tt aenn mcp9700at-e/tt afnn mcp9700t-h/tt agnn mcp9701t-e/tt amnn mcp9701at-e/tt apnn note: applies to 3-lead sot-23. xxnn ae25 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec ? designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e xxxxxx xxxxxx xxxxxx ywwnnn example mcp 9700e to 614256 3 e device mcp9700-e/to mcp9700a-e/to mcp9701-e/to mcp9701a-e/to note: applies to 3-lead to-92.
? 2005-2016 microchip technology inc. ds20001942g-page 11 mcp9700/9700a and mcp9701/9701a   
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mcp9700/9700a and mcp9701/9701a ds20001942g-page 14 ? 2005-2016 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2005-2016 microchip technology inc. ds20001942g-page 15 mcp9700/9700a and mcp9701/9701a    
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mcp9700/9700a and mcp9701/9701a ds20001942g-page 16 ? 2005-2016 microchip technology inc. notes:
? 2005-2016 microchip technology inc. ds20001942g-page 17 mcp9700/9700a and mcp9701/9701a appendix a: revision history revision g (june 2016) the following is the list of modifications: 1. added the mcp9700t-h/tt package version. 2. minor typographical changes. revision f (july 2014) the following is the list of modifications: 3. updated the package type information. 4. note 4 in the dc electrical characteristics table was added. 5. updated the temperature range in the product identification system section. 6. added maximum idd specification for the high temperature device. revision e (april 2009) the following is the list of modifications: 1. added high temperature option throughout document. 2. updated plots to reflect the high temperature performance. 3. updated package outline drawings. 4. updated revision history. revision d (october 2007) the following is the list of modifications: 1. added the 3-lead sot-23 devices to data sheet. 2. replaced figure 2-15. 3. updated package outline drawings. revision c (june 2006) the following is the list of modifications: 1. added the mcp9700a and mcp9701a devices to data sheet. 2. added to92 package for the mcp9700/mcp9701. revision b (october 2005) the following is the list of modifications: 1. added section 3.0 ?pin descriptions?. 2. added the linear active thermistor? ic trademark. 3. removed the 2 nd order temperature equation and the temperature coeficient histogram. 4. added a reference to an1001 and correspond- ing verbiage. 5. added figure 4-2 and corresponding verbiage. revision a (november 2005) ? original release of this document.
mcp9700/9700a and mcp9701/9701a ds20001942g-page 18 ? 2005-2016 microchip technology inc. notes:
? 2005-2016 microchip technology inc. ds20001942g-page 19 mcp9700/9700a and mcp9701/9701a product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device: mcp9700: linear active thermistor? ic mcp9700a: linear active thermistor? ic mcp9701: linear active thermistor? ic mcp9701a: linear active thermistor? ic tape and reel: t = tape and reel ( 1 ) blank = tube temperature range: e = -40 ? c to +125 ? c (extended temperature) h= -40 ? c to +150 ? c (high temperature) (mcp9700, sot-23-3 and sc70-5 only) package: lt = plastic small outline transistor, 5-lead to = plastic transistor outline, 3-lead tt = plastic small outline transistor, 3-lead part no. x /xx package temperature range device examples: a) mcp9700t-e/lt: linear active thermistor ic tape and reel extended temperature 5ld sc70 package b) mcp9700-e/to: linear active thermistor ic extended temperature 3ld to-92 package c) mcp9700t-e/tt: linear active thermistor ic tape and reel extended temperature 3ld sot-23 package d) mcp9700t-h/lt: linear active thermistor ic tape and reel high temperature 5ld sc70 package a) mcp9700at-e/lt: linear active thermistor ic tape and reel extended temperature 5ld sc70 package b) mcp9700a-e/to: linear active thermistor ic extended temperature 3ld to-92 package c) mcp9700at-e/tt: linear active thermistor ic tape and reel extended temperature 3ld sot-23 package a) mcp9701t-e/lt: linear active thermistor ic tape and reel extended temperature 5ld sc70 package b) mcp9701-e/to: linear active thermistor ic extended temperature 3ld to-92 package c) mcp9701t-e/tt: linear active thermistor ic tape and reel extended temperature 3ld sot-23 package a) mcp9701at-e/lt: linear active thermistor ic tape and reel extended temperature 5ld sc70 package b) mcp9701a-e/to: linear active thermistor ic extended temperature 3ld to-92 package c) mcp9701at-e/tt: linear active thermistor ic tape and reel extended temperature 3ld sot-23 package a) mcp9700t-h/tt: linear active thermistor ic tape and reel high temperature 3ld sot-23 package b) mcp9700t-h/lt: linear active thermistor ic tape and reel high temperature 5ld sc70 package ? x ( 1 ) tape and reel option note 1: tape and reel identifier only appears in the catalog part number description. this identifier is used for ordering purposes and is not printed on the device package. check with your microchip sales office for package availability with the tape and reel option.
mcp9700/9700a and mcp9701/9701a ds20001942g-page 20 ? 2005-2016 microchip technology inc. notes:
? 2005-2016 microchip technology inc. ds20001942g-page 21 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights unless otherwise stated. trademarks the microchip name and logo, the microchip logo, anyrate, dspic, flashflex, flexpwr, heldo, jukeblox, keeloq, keeloq logo, kleer, lancheck, link md, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. clockworks, the embedded control solutions company, ethersynch, hyper speed control, hyperlight load, intellimos, mtouch, precision edge, and quiet-wire are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, any capacitor, anyin, anyout, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dynamic average matching, dam, ecan, ethergreen, in-circuit serial programming, icsp, inter-chip connectivity, jitterblocker, kleernet, kleernet logo, miwi, motorbench, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, puresilicon, righttouch logo, real ice, ripple blocker, serial quad i/o, sqi, superswitcher, superswitcher ii, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered trademar ks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2005-2016, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-5224-0666-2 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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